Hi Andrija !
Thank`s for your reply !
In 3D CAD the component height on the evaluation-board below the module is 0,55mm (RA4, RA5, …) and the module is around 2,75mm distance to the evaluation-board.
With a component heigth of 2,2mm on the Module there is 0,0mm space (so no space) between the components of the evaluation-board and the module (maybe more/less when considering tolerances).
So with the actual documentation there is not even possible to place a 0402 decoupling-capacitor below the module with the connector used on the evaluation-board (Tyco 1473005-1). Here we checked the board-design of the evaluation-board how this problem was solved there.
There we saw the decoupling-capacitors are placed&routed against the rules of the “Carrier Board Design Guide”, “Layout Design Guide” and state of the art of electronic design, LOL ^^
Is it possible to get a more detailed documentation of the component heights on the module (facing the carrier-board), to place parts below the module with this board connector ?
Thank you !