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Verdin iMX8M Plus Custom Carrier Board Design
QSPI Interface and Interrupt Configuration
Based on the Verdin iMX8M Plus V1.1 datasheet, the i.MX 8M Plus features a Flexible SPI Controller (FlexSPI) with up to two SPI channels (1)(2). However, only one channel is available on the module edge connector pins (1)(2). The controller supports single, dual, quad, and octal mode data transfer (1)(2). Since the second SPI channel is not available, the octal mode cannot be used (1)(2).
The Verdin standard offers one QuadSPI channel with two chip selects for up to two memory devices in the “Reserved” pin class (1)(2). However, only the first chip select pin is available from the FlexSPI controller (1)(2). The second chip select pin on the module edge connector is a regular GPIO (1)(2). Therefore, the support for dual device memory is limited (1)(2).
Available GPIO Pins for Interrupts
For interrupt pins alongside the QSPI interface, you can utilize the dedicated camera GPIO signals that are available on the Verdin iMX8M Plus (3):
- Pin 216: GPIO_5_CSI (GPIO1_IO7) - Dedicated camera GPIO signal (3)
- Pin 218: GPIO_6_CSI (GPIO1_IO8) - Dedicated camera GPIO signal (3)
- Pin 220: GPIO_7_CSI (GPIO4_IO3) - Dedicated camera GPIO signal (3)
- Pin 222: GPIO_8_CSI (GPIO4_IO1) - Dedicated camera GPIO signal (3)
These GPIO pins can be configured as interrupt inputs for your QSPI interface implementation.
Design Resources and Documentation
Datasheets
The most current datasheet available is the Verdin iMX8M Plus V1.1 datasheet (1). This contains the complete interface descriptions and pin mappings you’ll need for your custom carrier board design.
Carrier Board Design Resources
For designing your custom carrier board, Toradex provides comprehensive design resources (4):
- Carrier Board Design Section with free reference designs, schematics, 3D designs and tools (4)
- Verdin Family Specification documentation (4)
- Toradex Pinout Designer tool (4)
3D Models
Toradex provides both generic and specific 3D mechanical models (4):
- Generic Verdin 3D Mechanical Models: Contains maximum component height for testing mechanical fit (4)
- Specific Verdin iMX8M Plus 3D Models: Simplified models containing only PCB and CPU for heat spreader/heat sink designs (4)
Available formats include SolidWorks CAD models, 3D STEP models, and 3D PDF models (4).
Hardware Specifications and Voltage Levels
For detailed electrical specifications including voltage levels (VOL, VIL, VOH, VIH), you’ll need to refer to the complete Verdin iMX8M Plus V1.1 datasheet (1) and the Verdin Family Specification (4). These documents contain the comprehensive electrical characteristics and interface specifications required for your carrier board design.
The interface can be used for accessing NAND and NOR flashes over the QuadSPI standard, and can also be used for interfacing HyperBus and FPGA devices (1)(2).
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